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Direct copper metallization by wet process in the through glass via (TGV) 7월 03, 2017 3D semiconductor copper direct seed TGV through glass via via filling +
Polyimide via filling on the copper plate 6월 01, 2017 copper copper fill electrodeposition fill high power LED plating polyimide semiconductor thermal via +
etched polyimide pattern(thickness 30um) on copper sheet 5월 23, 2017 etching high power LED polyimide +
metal filter for the detection of circulating tumor cells 5월 07, 2017 circulating tumor cell electroforming metal filter permanent mandrel +
surface etched through glass via(TGV) 5월 04, 2017 ceramic circuit glass circuit board interposer TGV through glass via +