Generally ceramic has the advantages of high temperature usage and mechanical strength.
The photosensitive glass changes from glass to ceramic by UV exposure and heat treatment.
The following pictures shows through ceramic via changed from through glass via.
Because the holes are formed anisotropically by wet etching, any shapes of hole can be fabricated.
The rectangular holes were formed at the following wafer.
The photosensitive glass changes from glass to ceramic by UV exposure and heat treatment.
The following pictures shows through ceramic via changed from through glass via.
Because the holes are formed anisotropically by wet etching, any shapes of hole can be fabricated.
The rectangular holes were formed at the following wafer.
 |
| 4" through ceramic via substrate |
 |
| microscopy of upper wafer |
댓글
댓글 쓰기