pure silver filled TGV(through glass via)

Via filling by paste method is very convenient and novice can fill the via without special filling systems.

Generally silver pastes contain the organic or inorganic materials.

Silver/organic paste has low curing temperature(~200), so its resistivity is high.
Silver/inorganic paste's resistivity is low but its sintering temperature is high.(400~1200C)

But pure silver via fill is possible using special silver powder.

The pictures show the pure silver filled through glass via.
The sintering temperature is 200C.