Via fill processes
- electroplating
- paste process : filling and sintering or drying
- melt process
I made under via fill substrate by printing and sitering. Silver paste with the sintering temperature of 590C was filled.
For the high power devices(LED, semiconductor..), I will fill the via with copper by new method.
- electroplating
- paste process : filling and sintering or drying
- melt process
I made under via fill substrate by printing and sitering. Silver paste with the sintering temperature of 590C was filled.
For the high power devices(LED, semiconductor..), I will fill the via with copper by new method.
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