Micromachining and Appications

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Patent to fabricate micro bump or pillar

9월 24, 2015

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This was accepted this year.

Other patents related to WLP were accepted too.

Via metallizing method will be sooner or later.

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가장 많이 본 글

TGV(through glass via) : glass micromachining by wet etching

method : photolithography/development/wet etching(HF solution) glass thickness : 200um, 300um hole size : 14, 16, 18, 20um

Shadow mask for OLEDoS

AR(augmented reality) or VR(virtual reality) display need very fine pixelㄴ. Generally OLED materials are deposited on the silicon wafer for the these displays. So it is hard to adopt the common invar shadow mask. To avoid the problems by thermal expansion, the shadow mask like below is derived. 4-1 is silicon frame and 4-2 is shadow mask. The materials of shadow mask can be glass, silicon, metal and so on. If glass shadow mask is used, repair is easy but precision bonding process is needed. Also full silicon shadow mask is also possible using under process. But some area of shadow mask is damaged, total shadow mask can be useless.

The concept of micro LED display using glass micromachining

A major problem is a pick and place in micro LED display. So I thought below concept. The glass is micromachined using photolithography process. There are the holes for through glass electrodes and pockets for micro LED distribution in the glass. After glass micromachining, the micro LED is placed in the glass. Because of the pockets for LEDs, they are distributed simply. The LED will be bonded with glass substrate simultaneously after pressing and heating. - through glass via : 5~20um - glass thickness : 100~400um

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Micromachining and Appications

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Patent to fabricate micro bump or pillar

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